真空樹(shù)脂塞孔機(jī)是一種專(zhuān)業(yè)用于PCB（印刷電路板）制造的關(guān)鍵設(shè)備，通過(guò)真空技術(shù)填充孔洞（如通孔、盲孔等），確保孔洞絕緣性、穩(wěn)定性和無(wú)氣泡缺陷。
以下是其主要介紹：Resin vacuum screen printing plug hole machine | Vacuum resin plug hole machine | Vacuum screen printing plug hole machine | Vacuum horizontal screen printing plug hole machine | Vacuum horizontal scr
工作原理?：設(shè)備在無(wú)氣環(huán)境下抽取孔洞空氣形成負(fù)壓（真空度可達(dá)15-50Pa），再填充樹(shù)脂或油墨，避免氣泡和空洞，保證填充飽滿(mǎn)均勻。
核心特點(diǎn)?：
高真空系統(tǒng)：極限真空度達(dá)15-20Pa，徹底消除孔內(nèi)氣孔和凹陷問(wèn)題，適用于高縱橫比（如80:1）生產(chǎn)。
自動(dòng)化設(shè)計(jì)：集成CCD對(duì)位系統(tǒng)，精度達(dá)0.02mm，一鍵設(shè)定參數(shù)（如塞孔壓力、速度），減少人工依賴(lài)。
高效產(chǎn)能：雙臺(tái)面結(jié)構(gòu)提升產(chǎn)能1.5-2倍，日增產(chǎn)1000-2000片板，大幅縮短調(diào)機(jī)時(shí)間至30分鐘內(nèi)。
操作便利：兼容各類(lèi)PCB板（硬板、軟板、載板），支持網(wǎng)板自動(dòng)清潔和油墨添加功能。
應(yīng)用場(chǎng)景?：主要用于PCB多層板、HDI板、IC載板等的樹(shù)脂、銅膠或銀膠填充，處理通孔、盲孔、背鉆孔等復(fù)雜工藝。
性能規(guī)格?：
基板尺寸：**825×1100mm，最小50×150mm；厚度范圍0.1-8mm。
塞孔能力：通孔徑0.1-2.0mm（縱橫比30:1），盲孔徑0.05-0.5mm（縱橫比5:1）。
產(chǎn)能：每小時(shí)20-40片，視板厚和真空度調(diào)整。
發(fā)展趨勢(shì)?：向全自動(dòng)化升級(jí)，如黑燈式方案整合研磨線(xiàn)，結(jié)合AGV或機(jī)械手實(shí)現(xiàn)無(wú)人化生產(chǎn)。
The vacuum resin plug hole machine is a key equipment specialized in PCB (printed circuit board) manufacturing, which uses vacuum technology to fill holes (such as through holes, blind holes, etc.) to ensure hole insulation, stability, and no bubble defects.
Here is its main introduction:
twenty million two hundred and fifty thousand eight hundred and fifteen
Working principle: The equipment extracts air from the holes in a airless environment to create negative pressure (with a vacuum degree of up to 15-50Pa), and then fills them with resin or ink to avoid bubbles and voids, ensuring full and uniform filling.
Core features:
High vacuum system: With a maximum vacuum degree of 15-20Pa, it completely eliminates the problems of pores and dents inside the holes, making it suitable for high aspect ratio (such as 80:1) production.
Automated design: Integrated CCD alignment system with an accuracy of 0.02mm, one click parameter setting (such as plug hole pressure and speed), reducing manual dependence.
Efficient production capacity: The dual table structure increases production capacity by 1.5-2 times, with a daily increase of 1000-2000 boards and a significant reduction in machine adjustment time to within 30 minutes.
Easy to operate: compatible with various PCB boards (hard board, soft board, carrier board), supporting automatic cleaning of mesh boards and ink addition function.
Application scenarios: Mainly used for resin, copper or silver glue filling of PCB multilayer boards, HDI boards, IC carrier boards, etc., and for processing complex processes such as through holes, blind holes, and back drilling.
Performance specifications:
Substrate size: maximum 825 × 1100mm, minimum 50 × 150mm; thickness range 0.1-8mm.
Hole blocking ability: The through-hole diameter is 0.1-2.0mm (aspect ratio 30:1), and the blind hole diameter is 0.05-0.5mm (aspect ratio 5:1).
Capacity: 20-40 pieces per hour, adjusted according to plate thickness and vacuum degree.
Development trend: Upgrade to full automation, such as integrating grinding lines with black light solutions and combining AGV or robotic arms to achieve unmanned production.
